4-Chloro-7-methoxy-N-methylquinoline-6-carboxamide, 97%, 1g

2-Hydroxy-3-methoxy-3,3-diphenylpropanoic acid, 95.0%, 1g

2-(DIFLUOROMETHYL)-5-PYRIMIDINOL, 95.0%, 250mg

(S)-2-Amino-3-(4-(methylsulfonyl)phenyl)propanoic acid, 98%, 250mg

6-(METHOXYCARBONYL)-1H-INDAZOLE-3-CARBOXYLIC ACID, 95%, 250mg

2-(4-(2-(Trifluoromethyl)benzoyl)piperazin-1-yl)thiazole-5-carboxylic acid, 95.0%, 250mg

1-(TRIISOPROPYLSILYL)-1H-INDOLE-6-SULFONYLCHLORIDE, 95.0%, 100mg

Methyl 5-chloro-2-nitrobenzoate, 95.0%, 500g

Collegamento con giunto sferico, 35, 120 mm, 10 Pezzo(i)

(S)-2-(3-Benzoylphenyl)propanoic acid, 95.0%, 100mg

4-(2-Methoxyethoxy)aniline, 95.0%, 10g

Perossido di idrogeno 30%, grado VLSI, 2,5 l, sacchetto di plastica.

Naphthalene-2-sulfonamide, 97%, 25g